Anisotropic Etching of a Bulk Silicon Wafer

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Created 1/18/2005 6:00:00 AM

ESEM image of smooth sidewalls of single crystal silicon formed by anisotropic wet etching. The underlying Si was chemically etched anisotropically using KOH/H 2 O solution.

Credits

• John A. Rogers , 3D Micro- and Nanosystems, Beckman Institute
• Jong-Hyun Ahn , 3D Micro- and Nanosystems, Beckman Institute